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SMT Assembly Services

Surface-mount assembly is where pad design, paste volume, and reflow profile meet. MOZPCB runs SMT for prototypes and small batches with inspection gates matched to your BOM risk—not a one-size line recipe.

Send BOM for SMT assembly quote View PCB capabilities

Service overview

SMT assembly covers everything placed and reflowed on the board surface: passives from 0201 class through fine-pitch ICs, BGAs, QFNs, and connectors. Yield depends on stencil apertures, pad geometry, component moisture handling, and whether the board finish supports the pitch you designed.

MOZPCB supports single- and double-sided SMT on multilayer assemblies, with mixed-technology flows when through-hole parts follow reflow. Consigned kits and sourcing-assisted builds are both in scope; either way, centroid data, polarity rules, and assembly drawings are verified at intake.

Prototype SMT emphasizes first-article feedback: paste issues, tombstoning on small passives, and BGA void patterns surface early when inspection is planned—not after you build 500 boards.

What we offer

  • Single- and double-sided SMT placement
  • Fine-pitch QFP, BGA, QFN, and 0402/0201 class passives (design-dependent)
  • Stencil aperture review against pad and paste requirements
  • Reflow profiling for board mass, finish, and package mix
  • AOI for solder joints, polarity, and component presence
  • X-ray inspection for area-array packages when specified
  • MSL handling, baking, and dry-pack protocols
  • Partial population and bring-up builds for incremental validation

Technical capabilities

  • Lead-free reflow profiles with documented peak and soak windows
  • Nitrogen reflow when specified for select programs
  • Conformal coating and selective masking after SMT when requested
  • Serialization and packaging formats for downstream integration
  • Mixed SMT + selective wave or selective solder sequences

Common applications

  • IoT and consumer electronics prototypes
  • Industrial control and embedded modules
  • Networking and telecom line cards
  • Medical and wellness device pilot builds
  • Dense digital boards with multiple fine-pitch ICs

How the process works

  1. 01

    Data and kit intake

    BOM, centroid, assembly drawing, and board finish notes are verified before scheduling.

  2. 02

    Stencil and profile setup

    Apertures and reflow parameters are set against package mix and board thermal mass.

  3. 03

    SMT run and inspection

    Placement and reflow follow the traveler with AOI and optional X-ray gates.

  4. 04

    First article and release

    FA feedback closes open issues before remaining quantity releases.

SMT line & inspection

  • SMT placement line with component reels
    SMT placement
  • Component reel feeders loaded on the line
    Reel feeders
  • Reflow soldering oven
    Reflow soldering
  • Automatic through-hole insertion machine
    THT insertion
  • AOI optical inspection of assembled boards
    AOI inspection
  • Operators inspecting assembled PCBA
    Manual inspection

Related services

PCB Assembly Services Turnkey PCB Assembly Services View PCB capabilities Request a quote

FAQ

What files do you need for an SMT quote?
BOM with MPNs, centroid/pick-and-place file, assembly drawing with polarity, board quantity and revision, and test/inspection expectations. For consigned kits, include a kit list and MSL notes.
Do you assemble BGAs and QFNs?
Yes, with pad and stencil review. Open vias in pads, insufficient mask dams, and marginal paste volume are flagged in DFM before first article.
Is SMT-only assembly available without through-hole?
Yes. Many boards are SMT-only. Mixed technology is quoted when connectors or magnetics require through-hole steps.
How does SMT differ from full PCB assembly on your site?
SMT is the surface-mount scope specifically—placement and reflow of SMT parts. Full PCB assembly includes SMT plus through-hole, test, and coating as needed. This page focuses on SMT capability and process.

Get started

Ready for the next step?

Send your project files and requirements. We will review stackup, assembly, and test needs, then respond with a clear quotation path.

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