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HDI PCB Manufacturing Services

High-density interconnect PCBs help teams shrink package size while maintaining signal integrity. MOZPCB supports advanced stackups where design rules and materials align.

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Service overview

HDI designs lean on microvias, tight registration, and disciplined stackup planning. We review your via structures, pad stacks, and sequential lamination assumptions before committing to tooling.

HDI is one of our core specializations rather than an edge case. Every HDI quote includes an engineering review of the via architecture—whether a 1+N+1 build with laser microvias meets your escape routing, or whether stacked and staggered vias in a 2+N+2 or 3+N+3 construction are genuinely required—because each additional lamination cycle adds cost and yield risk.

Applications range from compact wearables to dense networking blades—each with different reliability and thermal constraints we document up front.

What we offer

  • HDI structures from 1+N+1 through 3+N+3 and any-layer builds, subject to design review
  • Laser-drilled microvias, blind and buried vias, and via-in-pad with fill and cap plating
  • Fine line and space processing where mechanical and imaging limits allow
  • Stackup engineering for 0.4 mm and 0.5 mm pitch BGA escape routing
  • Material sets suited to high-speed or low-loss requirements when specified
  • Controlled impedance with documented tolerance targets and test coupons
  • Inspection strategies that reflect the defect modes HDI processes see most often
  • DFM feedback on pad stacks, aspect ratios, and copper balancing before tooling

Technical capabilities

  • Microvia diameters typically 0.1 mm (4 mil) and up, laser-drilled, per stackup review
  • Line width and spacing down to 0.075 mm (3 mil) where imaging and copper weight allow
  • Multiple sequential lamination cycles (1+N+1, 2+N+2, 3+N+3) subject to design review
  • Via-in-pad with resin fill and copper cap plating for dense BGA fields
  • Controlled depth routing and via fill requirements documented per job
  • Copper balancing recommendations to reduce bow and twist risk
  • Low-loss and high-speed laminate options for signal-integrity-driven designs

Common applications

  • Consumer electronics with aggressive Z-height limits
  • Smartphones, wearables, and hearables with fine-pitch BGA and SiP packages
  • Medical and diagnostic instruments requiring dense interconnect
  • Communication modules, 5G radios, and antenna-in-package adjacent routing
  • Avionics and aerospace instrumentation where weight and density both matter

How the process works

  1. 01

    Requirements intake

    Share Gerber, BOM, drawings, quantities, and any reliability or compliance notes.

  2. 02

    Technical alignment

    We confirm materials, finishes, assembly flow, and test expectations with you.

  3. 03

    Production & inspection

    Manufacturing and assembly follow the agreed traveler with documented checks.

  4. 04

    Delivery

    Packing, labeling, and shipment according to your logistics instructions.

In our factory

  • PCB copper plating line
    Plating line
  • Panelized PCBs after fabrication
    Panelized boards
  • Laminate and core material storage
    Laminate store

Related services

Custom PCB Fabrication Services Prototype PCB Manufacturing Services View PCB capabilities Request a quote

FAQ

When should I choose HDI instead of a standard multilayer board?
HDI makes sense when escape routing, BGA pitch, or z-height drives microvias and fine lines. If standard through-holes and larger vias meet density goals, a conventional multilayer may be simpler and more cost-effective.
What is the difference between 1+N+1, 2+N+2, and 3+N+3 HDI stackups?
The numbers describe how many sequential lamination cycles surround the core: 1+N+1 has one microvia layer on each side, 2+N+2 has two, and so on. Each added cycle enables stacked or staggered microvias and denser routing, but increases cost and processing time, so we help you choose the simplest structure that routes your design.
Do you support via-in-pad for BGA designs?
Yes. Via-in-pad with resin fill and copper cap plating is standard practice for 0.4 mm and 0.5 mm pitch BGA fields. Flag via-in-pad locations in your fab notes so plating and planarization are quoted correctly.
How much does sequential lamination affect HDI PCB cost?
Significantly. Each lamination cycle adds drilling, plating, and registration steps, and yield risk compounds with each cycle. Moving from 1+N+1 to 2+N+2 typically raises cost noticeably, which is why we review whether staggered vias in fewer cycles can replace stacked vias before quoting.
Do you review sequential lamination before quoting?
Yes. Sequential lamination drives cost and yield. Share your intended via structures early so we can align expectations.

Get started

Ready for the next step?

Send your project files and requirements. We will review stackup, assembly, and test needs, then respond with a clear quotation path.

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