<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom">
  <channel>
    <title>MOZPCB Blog &amp; Resources</title>
    <link>https://mozpcb.com/blog/</link>
    <description>Practical articles on PCB manufacturing, DFM, stackups, surface finishes, and assembly from MOZPCB.</description>
    <language>en-us</language>
    <lastBuildDate>Sun, 26 Jul 2026 00:13:30 GMT</lastBuildDate>
    <atom:link href="https://mozpcb.com/rss.xml" rel="self" type="application/rss+xml" />
    <item>
      <title>How to Choose PCB Materials: FR-4, Rogers, Polyimide, Metal Core</title>
      <link>https://mozpcb.com/blog/how-to-choose-pcb-materials/</link>
      <guid isPermaLink="true">https://mozpcb.com/blog/how-to-choose-pcb-materials/</guid>
      <pubDate>Wed, 22 Jul 2026 00:00:00 GMT</pubDate>
      <description>A material selection guide for rigid FR-4, high-Tg and low-loss laminates, flex polyimide, Rogers/PTFE, and metal core—matched to thermal, mechanical, and SI requirements.</description>
      <category>PCB Manufacturing</category>
    </item>
    <item>
      <title>BGA Assembly and X-Ray Inspection Explained</title>
      <link>https://mozpcb.com/blog/bga-assembly-x-ray-inspection/</link>
      <guid isPermaLink="true">https://mozpcb.com/blog/bga-assembly-x-ray-inspection/</guid>
      <pubDate>Mon, 20 Jul 2026 00:00:00 GMT</pubDate>
      <description>Why area-array packages need paste and pad design review, when AOI is not enough, and how X-ray inspection fits prototype and production PCBA gates.</description>
      <category>PCB Assembly</category>
    </item>
    <item>
      <title>DFM Checklist Before PCB Production Release</title>
      <link>https://mozpcb.com/blog/dfm-checklist-before-production/</link>
      <guid isPermaLink="true">https://mozpcb.com/blog/dfm-checklist-before-production/</guid>
      <pubDate>Wed, 15 Jul 2026 00:00:00 GMT</pubDate>
      <description>A practical pre-production checklist covering fabrication, assembly, test access, and documentation—so your release package survives engineering review without a respin.</description>
      <category>PCB Design Guide</category>
    </item>
    <item>
      <title>SMT vs Through-Hole Assembly: Process and Cost Differences</title>
      <link>https://mozpcb.com/blog/smt-vs-through-hole-assembly/</link>
      <guid isPermaLink="true">https://mozpcb.com/blog/smt-vs-through-hole-assembly/</guid>
      <pubDate>Wed, 08 Jul 2026 00:00:00 GMT</pubDate>
      <description>When surface-mount wins, when through-hole still matters, and how mixed-technology boards sequence SMT, wave, and selective solder without yield surprises.</description>
      <category>PCB Assembly</category>
    </item>
    <item>
      <title>PCB Stackup Planning for Controlled Impedance</title>
      <link>https://mozpcb.com/blog/pcb-stackup-controlled-impedance/</link>
      <guid isPermaLink="true">https://mozpcb.com/blog/pcb-stackup-controlled-impedance/</guid>
      <pubDate>Wed, 01 Jul 2026 00:00:00 GMT</pubDate>
      <description>How to build a stackup table that fabricators can quote and your SI team can measure: reference planes, dielectric targets, differential pairs, coupons, and tolerance choices.</description>
      <category>PCB Design Guide</category>
    </item>
    <item>
      <title>Turnkey vs Consignment PCB Assembly: Which Model Fits Your Project</title>
      <link>https://mozpcb.com/blog/turnkey-vs-consignment-pcb-assembly/</link>
      <guid isPermaLink="true">https://mozpcb.com/blog/turnkey-vs-consignment-pcb-assembly/</guid>
      <pubDate>Tue, 23 Jun 2026 00:00:00 GMT</pubDate>
      <description>Who buys the components changes everything: cost visibility, lead time, risk ownership, and how much engineering time you spend. A practical guide to choosing between turnkey, consignment, and hybrid assembly.</description>
      <category>PCB Assembly</category>
    </item>
    <item>
      <title>Rigid-Flex PCB Design Guide: Bend Radius, Stiffeners, and Coverlay</title>
      <link>https://mozpcb.com/blog/rigid-flex-pcb-design-guide/</link>
      <guid isPermaLink="true">https://mozpcb.com/blog/rigid-flex-pcb-design-guide/</guid>
      <pubDate>Tue, 09 Jun 2026 00:00:00 GMT</pubDate>
      <description>The mechanical decisions that make or break rigid-flex designs: bend radius rules, static vs dynamic flexing, stiffener strategy, coverlay openings, and stackup choices.</description>
      <category>PCB Design Guide</category>
    </item>
    <item>
      <title>PCB Surface Finish Comparison: HASL vs ENIG vs OSP vs Immersion Silver</title>
      <link>https://mozpcb.com/blog/pcb-surface-finish-comparison/</link>
      <guid isPermaLink="true">https://mozpcb.com/blog/pcb-surface-finish-comparison/</guid>
      <pubDate>Tue, 26 May 2026 00:00:00 GMT</pubDate>
      <description>A practical comparison of the four most common PCB surface finishes—solderability, flatness, shelf life, cost, and the failure modes each one brings.</description>
      <category>PCB Manufacturing</category>
    </item>
    <item>
      <title>HDI PCB Design Guide: Microvias, Stackups, and Cost Drivers</title>
      <link>https://mozpcb.com/blog/hdi-pcb-design-guide/</link>
      <guid isPermaLink="true">https://mozpcb.com/blog/hdi-pcb-design-guide/</guid>
      <pubDate>Tue, 12 May 2026 00:00:00 GMT</pubDate>
      <description>How microvia structures, sequential lamination, and via-in-pad decisions drive HDI cost and reliability—and how to choose the simplest stackup that routes your design.</description>
      <category>PCB Design Guide</category>
    </item>
    <item>
      <title>What to Expect from a DFM Review on Your PCB Stackup</title>
      <link>https://mozpcb.com/blog/dfm-review-what-to-expect/</link>
      <guid isPermaLink="true">https://mozpcb.com/blog/dfm-review-what-to-expect/</guid>
      <pubDate>Wed, 15 Apr 2026 00:00:00 GMT</pubDate>
      <description>What a real PCB DFM review covers—annular rings, mask slivers, copper balance, finish trade-offs, HDI and flex risks, and test access—and how to answer questions without slowing your quote.</description>
      <category>PCB Design Guide</category>
    </item>
    <item>
      <title>Preparing Gerber Files for Smooth PCB Manufacturing</title>
      <link>https://mozpcb.com/blog/preparing-gerbers-for-manufacturing/</link>
      <guid isPermaLink="true">https://mozpcb.com/blog/preparing-gerbers-for-manufacturing/</guid>
      <pubDate>Wed, 01 Apr 2026 00:00:00 GMT</pubDate>
      <description>A practical Gerber and fabrication-data checklist: layer naming, drill parity, apertures, stackup notes, impedance tables, and panelization decisions that cut RFQ back-and-forth before tooling.</description>
      <category>PCB Manufacturing</category>
    </item>
  </channel>
</rss>
